We describe a novel surface micromachining process for the fabrication of ceramic-type MEMS devices, such as free-standing cantilevers, that is based on the use of high-aspect ratio micromolds of SU8 and aluminum as sacrificial layer a) Schematic illustration of the ceramic-MEMS cantilever fabrication sequence based on SU-8 micromolds, b) Full wafer (100-mm) micro/macro-molds with the...Continue Reading

Transmission electron microscopy (TEM) image of a silica/SU-8 nanocomposite microcut (50nm). The silica nanoparticles are well dispersed into the epoxy matrix. Jiguet, S. ; Bertsch, A. ; Judelewicz, M. ; Hofmann, H. et al. Microelectronic engineering, vol. 83, 2006, p. 1966-1979 Full textContinue Reading

The use of low-stress SU8 nanocomposites as a functional material for micro-parts and coating applications is described in this paper Evolution with time of the coefficient of friction under a normal load of 2 N for Inox balls, B and M different concentration of silica filler in SU8. Jiguet, S ; Judelewicz, M ; Mischler,...Continue Reading

The increasing interests in micro-electro-mechanical systems (MEMS) has raised the requirement for photoresist materials with improved friction and wear properties for mechanically loaded 3D shaped microstructures Optical images of wear traces left by steel balls on (a) SU8, (b) SU8 after heat treatment, (c) A composite, (d) composite A after heat treatment, (e) B composite,...Continue Reading

Schematic cross section of the fabrication process for horizontal plane inductors in quartz package. Leroy, Christine ; Pisani, Marcelo B. ; Hibert, Cyrille ; Bouvet, Didier et al. Proceedings of the 2006 Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS, DTIP 2006, 2006Présenté à: DTIP 2006, Stresa, Italy, April 2006. Full textContinue Reading

A conductive composite photoresist has been developed for the direct photopatterning of electrodesA conductive composite photoresist has been developed for the direct photopatterning of electrodes. It is based on a dispersion of silver nanoparticles in SU8, a non-conductive, negative-tone photoresist. Manufactured structures have an electrical conduc- tivity at a low silver content of around 6...Continue Reading

The present thesis deals with new composite photoresists for the UV-LIGA and microstereolithography microfabrication processes. Jiguet, Sébastien ; Renaud, Philippe Lausanne: EPFL, 2004. Full textContinue Reading

The following paper describes a sacrificial layer method for the manufacturing of microfluidic devices in polyimide and SU-8. The technique uses heat-depolymerizable polycarbonates embedded in polyimide or SU-8 for the generation of microchannels and sealed cavities. The volatile decomposition products originating from thermolysis of the sacrificial material escape out of the embedding material by diffusion...Continue Reading

This paper describes new polymer/ceramic photosensitive resins that can be used in the microstereolithography process for manufacturing complex 3D components in composite material. These new resins contain high loads (up to 80 wt.%) of alumina nanoparticles, used as fillers in a photosensitive acrylate-based resin of low viscosity. With the nanopowder-filled resin we developed, various small...Continue Reading

Microstereolithography is a technique that allows the manufacture of small and complex three-dimensional (3D) components in plastic material. Many of the components produced by this technique are too small and too complex to be replicated by molding and, consequently, the produced components need to have adequate mechanical or chemical characteristics to be useful. Until now,...Continue Reading