Gersteltec offers ready-to-use formulated products. Customers can select filler types according to their choice. Several common fillers are used to get the desired end products that offer extremely high mechanical, physical and thermal resistance. Gersteltec Solutions for BioMEMS devices are designed to meet the challenging needs of the microfluidic, drug delivery, flexible display and drug delivery/dosing market. Advanced Photoresist GLM2060 products offer low stress behavior, transparent for special bonding at Low Temperature processing techniques. GCM3060 offer advanced conductive photo resist for interconnect technology in the field of biomedical and packaging semiconductors. GMC10XX colored and Black SU8 to meet the challenging needs of the display market as black matrix with higher OD and as RGB coating.
Gersteltec offers ready-to-use formulated products with different types of filler, pigments, ink and solvent (ceton, ether acetate, aromathic and more) according to your needs. Gersteltec photoepoxy materials and products meet and exceed the needs of the world´s leading microsystem device makers with advanced functional SU-8 photoresist.