SU-8 Functional Polymer

Our Advanced products: SU-8 Functional Polymer

Gersteltec offers ready-to-use formulated products. Customers can select filler types according to their choice. Several common fillers are used to get the desired end products that offer extremely high mechanical, physical and thermal resistance. Gersteltec Solutions for BioMEMS devices are designed to meet the challenging needs of the microfluidic, drug delivery, flexible display and drug delivery/dosing market. Advanced Photoresist GLM2060 products offer low stress behavior, transparent for special bonding at Low Temperature processing techniques. GCM3060 offer advanced conductive photo resist for interconnect technology in the field of biomedical and packaging semiconductors. GMC10XX colored and Black SU8 to meet the challenging needs of the display market as black matrix with higher OD and as RGB coating.

Gersteltec

Gersteltec offers ready-to-use formulated products with different types of filler, pigments, ink and solvent (ceton, ether acetate, aromathic and more) according to your needs. Gersteltec photoepoxy materials and products meet and exceed the needs of the world´s leading microsystem device makers with advanced functional SU-8 photoresist.

GLM2060

GLM2060 for layers between 5-28 µmSpray, Spin, Inkjet
GCM3060 for layers between 1-50 µmSpin, Spray, Inkjet
GLM1030 for layers between 0.5-1.2µmSpin, Spray, Inkjet
GLM1040 for layers between 0.9-3.2µmSpin, Spray, Inkjet
GLM1050 for layers betwwen 3-8µmSpin, Inkjet, Spray
GLM1060 for layers between 5-27µmSpin, Inkjet, Spray
GLM1070 for layers between 15-200µmSpin, Inkjet
GLM1075 for layers between 100-400µmSpin, Inkjet

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Low stress resin

GLM2060

Performances• The Gersteltec GLM2060 SU8 product line contains photoepoxy with silica nanocomposites for higher adhesion to different types of substrate at low temperature with high bonding forces and Low stress behaviour 17CTE. Low-K for low capacitive coupling, interlayer/passivation.
Applications• structuring, bonding, encapsulation and photolithography for active neural probes fabrications, layers as spacer, CMOS sensor, Flexible AMOLED low dielectric
Properties• Thin layers: 5-27μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Fracture stress 13-18MPa

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Advanced Silver conductive epoxy

GCM3060

Performances• Stable • Short bake time
Applications• 3D design• Shielding• Interconnect• BioMEMS, NanoMEMS, Electrodes, LIGA, (courtesy of Sebastien Jiguet LMIS4 EPFL Switzerland)
Properties• Thin layers: <20μm • Chemically resistant • Thermal stability: 350°C

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Colored photoresist

GMC10xx

Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
Applications• Dielectric layer with high resolution and complex shape for RGB • Coating by Spray, Anti-Reflective coating, Inkjet, E-Beam • Display and flexible display for biomedica, Microwells, NanoMEMS, (courtesy of Sebastien Jiguet Gersteltec Switzerland).
Properties• Thin/thick layers • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm

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Resist for Inkjet printing and Drop-on-Demand Processes

GMJ10XX

PerformancesUV-curable ink-solution, low viscosity, transparency
Applications• Dielectric layer with high resolution and complex shape for transistors, Coating protrcting layers, single micro lenses and micro-lens arrays for VCSEL's and LED, microfludic devices and wavguides, spacers. · Semiconductors Isolated /conductive layers transistor · Solar application interconnect and bonding technology · Display application for small/large coating area as barriers layers and active matrix . Thin film Encapsulation for AMOLED for display . Printing transistors
PropertiesLow viscosity 5-25mPas, excellent chemical, thermal and mechanical stability of cured patterns, high transparency for optical applications.

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Black Resist

Black SU8; GMC10XX, GMCD10XX

Performances• GMC10XX covers a wide range of thicknesses 100nm to few hundreds of microns. GCB10xx designed for black matrix with OD between 2-5 for thin film application 1-2µm
Applications• Gersteltec Black photoresist for Opto-MEMS, MEMS and display market. High absorbing coating used to reduce noise and unwanted reflections and to increase the efficiency of the optical system. Black matrix for display technologies. Microwell arrays biochips, CCD Image sensors, (courtesy Gersteltec).
Properties• Photoresist CB/SU8 products offer good compatibility with standard display and flexible substrates with different types of processing techniques. The Gersteltec carbon black SU8 product line contains photoepoxy with high optical density OD>5 at a thicknesses between 1-3μm. Gersteltec CB/SU8 prevents any leakage of backlight or RGB color coating by is higher OD.

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CNTS/Graphene Resist

CNTs-SU8 composites

Performances• Deposition by Inkjet, spray and screening for small and large surface.
Applications• Interconect, •Antennas, •Anti Static Layer and hard coating, (courtesy of Marijana Mionic LNMME-EPFL and Gersteltec Switzerland))
Properties•Unique mechanical, electrical and thermal properties with excellent chemical stability

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Black Ink-Jet printing and Drop-on-Demand Processes

GMJB10XX

Performances• Direct printing • Compatible with commercial inkjet printing equipment • Short bake time
Applications• Pixels • Absorber layer • MEMS, Microfludics, BioMEMS,
Properties • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm

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Low stress coating resist for gas, oil and drills pipes

GMP10XX

Performances• high hardness, wear and corrosion resistance and erosion protection. In some cases, a proprietary sealing process may be required where the application requires additional properties as: Superior resistance to harsh acids Reduced coefficient of friction Dielectric strength Anti-sedimentation
Applications• The SU8 photoresist coatings are used to improve the flow of gas through the pipeline by creating a smooth defect free surface-greatly increasing the flow of gas through the pipeline of gas and oil.
Properties• Thin layers • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Fracture stress 13-18MPa • Hardness: 370 MPa • CTE: 52 ppm

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Innovation and investment in the future are hallmarks of Gersteltec's approach

SU-8 photoresist is based on an epoxy resin developed by IBM. SU-8 is a thick, near-UV photoresist technology through i-line, and has advantages for the semiconductor industry as well as for microtechnologies and nano applications.

SU-8 is used in the development of MEMS, MOMES, UV-LIGA microfabrication and coatings. SU-8 can be patterned by several lithography techniques, such as X-ray, UV and e-Beam.

SU-8 is specifically used for applications requiring high aspect ratios in very thick layers with vertical sidewall profiles.

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