Chemical products

We have what you need: Chemical products

Gersteltec Solutions for Micro-Parts designed to meet the challenging needs to attain a level of extreme precision with high surface quality for watch industry and micro-parts. It is difficult to remove or re-pattern fully cross-linked SU-8 by conventional methods, such as wet chemical agents. By using Gersteltec Striper A you can remove the SU8 without caused any damage to your’s metals like Ni, Ni/Fe, Au, Cu. For high adhesion for differents types of substrata Gersteltec developed adhesion promoter that can be used.

Gersteltec

Gersteltec offers ready-to-use formulated products with different types of filler, pigments, ink and solvent (ceton, ether acetate, aromathic and more) according to your needs. Gersteltec photoepoxy materials and products meet and exceed the needs of the world´s leading microsystem device makers with advanced functional SU-8 photoresist.

Adhesion promoter, Developer and Striper

STRIP AStriper
DRGMDeveloper
ADPAdhesion Promoter

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Thick Resist

STRIP A

PerformancesSEM micrographs of (a) a HAR SU-8 mold, (b) electroplated metal with an SU-8 mold, (c) SU-8 removal by striper and (d) the released freestanding metal structure.
ApplicationsAn isotropic suspension system for a biaxial accelerometer using electroplated thick metal with a HAR SU-8 mold
PublishedJin Seung Lee and Seung S Lee

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STRIP A

Electroplated nickel comb structures after successful SU-8 mold removal

Performances1. Photoresist conditions: Photoresist: SU-8 Film thickness: 110-120 μm. No hard bake Electroformed thickness: 60-70 μm (Nickel) Stripped using Stripper SRGM SU-8 (Gersteltec, Switzerland)
ApplicationsFabrication and electromagnetic actuation of a freestanding electroplated micro structure
PublishedChii-Rong Yang and Fu-Hsien Wang

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Gears

STRIP A

Performances1. Photoresist conditions: Photoresist: SU-8 Film thickness: 110-120 μm. No hard bake Electroformed thickness: 60-70 μm (Nickel) Stripped using Stripper SU-8 (Gersteltec, Switzerland)
ApplicationsStrip SU-8 after deposition with Striper A
PublishedFu-Hsien Wang from NTNU MOMES Lab Taiwan

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Thick Resist

Dry etching SU8

Performances•Fast removal at low temperature 100°C without damage the metal, Etch rates of 1–4 lm min􏰕1 were obtained in RIE using a mixture of CF4/O2 in approximately equal proportions
Applications•LIGA, MEMS, Microparts, connectors, coumb
Properties• Thin layers: <0.2μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm

Plasma processes

Material Stripping, Surface Cleaning

PVA Tepla AG, MUEGGE GMBH, EVG

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Innovation and investment in the future are hallmarks of Gersteltec's approach

SU-8 photoresist is based on an epoxy resin developed by IBM. SU-8 is a thick, near-UV photoresist technology through i-line, and has advantages for the semiconductor industry as well as for microtechnologies and nano applications.

SU-8 is used in the development of MEMS, MOMES, UV-LIGA microfabrication and coatings. SU-8 can be patterned by several lithography techniques, such as X-ray, UV and e-Beam.

SU-8 is specifically used for applications requiring high aspect ratios in very thick layers with vertical sidewall profiles.

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