Switzerland
Switzerland
info@gersteltec.ch +41 (0)79 564 34 23 General-Guisan 26, 1009 Pully, Switzerland CH
endezhja
Switzerland
Switzerland
info@gersteltec.ch +41 (0)79 564 34 23 General-Guisan 26, 1009 Pully, Switzerland CH
endezhja
Gersteltec Engineering Solutions
Swiss Made SU-8 photoepoxy functional products for MEMS, LIGA and Microelectronics

Discover the many application areas of our products

Waveguides Optical amplifier, Optical switch, Optical cross-connect, LIDAR system, Micromirror, Lenses, Photonics crystal

Bio/Chemical Sensing, Cantilevers, GPS, Micro-arrays, µ traps, Actuators, Microwell Biochips, Valveless micropump.

OFET transistor, e-paper,

Gears, Grippers, Metallic part

Microfludic channels  design for future  fast viruses diagnostics and healthcare applications systems, microwells, flow cell devices, microchip electrophoresis and drugs delivery

Bonding, Cavities Assembly, Fan-Out Wafer level Packaging (FOWLP), Chip on Substrate (CoS), Chip on Wafer (CoW), design of multi-layer build up.

3D conducting  Ag/SU-8 Microgripper design using proton beam lithography, Laser micropattering.

Carbon electrodes design by using pyrolysis technique, Solar, Batteries, Fuels cells.

Display types LED, EPD, OLED and LCD  and as display for e-papers, smart cards,

Electrodes, Micro Electrode Array (MEA) system for stimulation

Waveguide structures, photonic crystal, Security Labels,

VCSEL’s , LED’s, Nanoscale waveguides, coupler for light coupling from fiber/Light-emitting diode (LED).

Ink formulation optimized for inkjet printing

Microprocess technology, such as photoresist, is supporting advancement in the electronics field.

Pipes,cars , Energy.

Photonics & Optic

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 95-120°C
  • Optical transparency
  • High aspect ratio imaging
  • Excellent adhesion

Application areas

The SU8 Photoepoxy series products are ready to use

Chemical modification of SU-8 gives rise to produce micro optical wave guides owing to changes in the refractive indices by insert nanoparticales and using thermal processing.

Type of usage

Our product can be used for Micro-mirror, Beam splitters, Dielectric layer, Spacer for lenses , Photonique Crystal, Inkjet printing of micro lenses. SU-8 wave guides have high thermal stability and very good adhesion properties to various substrates materials as well as good transparency values in the visible wavelength range that give you the possibility to change the refractive indices to design different types of wave guides devices. Difractive lenses, Optical micro prisms (courtesy of Wen-Fung Pan).

Formulation

Gersteltec offers ready-to-use formulated products that offer extremely high transparency in the visible wavelength range for optical transmission with high mechanical, physical, thermal resistance and very good adhesion properties to various substrate materials.

Microsystems / Sensors

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 95-120°C
  • High aspect ratio microstructures
  • High chemical and temperature resistance
  • High Optical transparency

Application areas

The SU8 Photoepoxy series products are ready to use

For next generation MEMS, MOMES sensors, smart sensor architecture – adding intelligence, with ultra-low power. Other techniques to realize micro-channels may be LIGA technologies or micro-stereolithography processes.

 

Type of usage

Biosensors (glucose test strips) organic photodetectors, Piezoresistive ( force sensors) electrochemical gas sensors, Capacities temperature, Piezoelectric  humidity, Ice sensor, pressure sensor array (courtesy of Sebastien Jiguet LMIS4 EPFL Switzerland))

Our Trademark

SU-8 offers the realization of monolithic auto-assembled channels for microfluidic applications, high aspect ratios micro-channels.

BioMEMS, Brain Sciences

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • High aspect ratio imaging
  • 0.5 to >300um in a single coat
  • High optical transparancy
  • Good adhesion of cell tissues.

Application areas

The SU8 Photoepoxy series products are ready to use

Gersteltec Solutions for microelectrode arrays (MEA’s) devices are designed to meet the challenging needs of the biocompatible market.

The Gersteltec SU8 product SU-8 negative photoresist is a high tensile strength polymer that use for a number of biomedical applications that include cell encapsulation and neuronal probes. 

Type of usage

In some case it is interesting to bring integrated microchannels to the different electrodes. Gersteltec product can be use for this topics as Organotypic brain slice cultures, Dissociated neuron Cultures and  Heart muscles cells (courtesy of Qwane Biosciences and Guillaume Petitpierre LMIS4 EPFL),

Formulation

Gersteltec offers ready-to-use formulated products without toxicity, the workspace is transparent that is subtitle to the design of the multi-electrode array and neural applications

Microparts / LIGA/ Microparts/ Electroforming

  • CTE 27 (ppm/K)
  • Low temperature processing 95-120°C
  • Chemical and mechanical resistance
  • Low thermal expansion
  • High aspect ratio imaging

Application areas

The SU8 Photoepoxy series products are ready to use

Gersteltec Solutions for Micro-Parts designed to meet the challenging needs to attain a level of extreme precision with high surface quality for watch industry and micro-parts.

Lithographie, Galvanoformung, Abformung (lithography, electroplating, and molding) known as LIGA is a fabrication technology used to create high-aspect-ratio microstructures Microparts. More specifically, UV LIGA was developed in 1990s for realizing molds in SU8 photoresist with UV 365nm photolithography  to fabricate metal gearwheels, springs that are some of the components exploited for the watch industry.

Type of usage

These watch industry is taking advantage from Gersteltec technology to produce all types of complex and innovative movements and components, from springs to balance wheels, spirals and bridges, gears and cases. The accurate and complex 3D shapes that can be ensured, the tribological behavior of the materials, the transparency and the esthetical effects that can be created on the pieces are only some of the main advantages of the technique (resolution typically of about 1–2 μm in plane and aspect ratio of 10), (courtesy of SURON Israel and Mimotec Switzerland).

Our Trademark

Gersteltec SU8 is well suited for  LIGA processing. its excellent sensitivity and achievable vertical side wall profile for high precision fabrication of micro compoments by X-ray and UV light. Photoresist resist products are available in 250ml, 500ml, 1 Liter, 4 Liter bottles, in addition we can package into 10 and 20 Liter Nowpaks.

µ-fludics

  • CTE 27 (ppm/K)
  • Low temperature processing 95-120°C
  • Chemical and mechanical resistance
  • Low thermal expansion
  • High aspect ratio imaging

Application areas

The SU8 Photoepoxy series products are ready to use

Microfluidics refers with the behavior and manipulation of precise amounts of fluids that are geometrically constrained to a small sub-millimeter channels which allow different analytical measurement technique as DNA chips, lab-on-a-chip technology, integrated electrodes on chips, micro-propulsion, energy generation and micro-thermal technologies. Microfludics are being used in BioMEMS applications

Type of usage

These industry is taking advantage from Gersteltec technology to produce all types of complex and innovative Microfludic to realize Cellular, Molecular, Immunological,  diagnostics. As cells traps, Droplet microfluidics, Drugs Delivery, High-throughput Screening, electrochemical sensors, (courtesy of Duchamp Margaux Marie and Sebatien Jiguet LMSI4 EPFL Switzerland). 

Formulation

Gersteltec offers ready-to-use formulated products without toxicity for microfluidic channels, and neural applications

Smart Packaging, Wafer-Level Package (WLP) Chip-Scale Packaging (CSP)

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 95-120°C
  • Capable of multi-layer build up
  • Low residual stress (17CTE) and Low shrinkage on cure

Application areas

The SU8 Photoepoxy series products are ready to use

Easy assembly and low-temperature processing. Smart packaging for Microfluidics, Implementation of Wafer Level Packaging a keep-out-zone (KOZ) using SU-8 as Dielectric for the Merging of WLFO to Microfluidic and Biomedical Applications (NANIUM). Low-temperature processing (<150°C), low shrinkage on cure. BGA/SMT mounting.

Type of usage

The good chemical resistance and mechanical strength of SU-8 allow its application for assembly, packaging and housing solutions of selectronic and sensor micro components. As dielectric photo-resist material in Wafer Level Fan Out (WLFO) and provides the integration of bio-sensing and biomedical devices in the same chip. These assembly solutions are realized by means of UV lithography. Bonding at low temperature, a strong bonding  tensile strength about 7-17MPa.  ( Courtesy of Nanium Portugal, Christine Leroy, LEG, EPFL, Switzerland).

Our Trademark

At Gersteltec, the smallest particles have a big effect: Gersteltec uses nano-objects to develop and produce innovative high-technology additives that give completely new combinations of properties to a wide range of epoxy substances. The results are materials with superior characteristics that give our clients a decisive lead over the competition.

Nanoscaled Devices & Nanoimprint

  • Very High Resolution <10nm.
  • Very High Aspect Ratio
  • Low temperature processing 95-120°C
  • X-ray. E-Beam and P-Beam imageable
  • Low thermal expansion
  • CTE 27 (ppm/K)

Application areas

The SU8 Photoepoxy for nanoscaled printing series products are ready to use

The electron beam lithography hardware has improved continuously over the past few decades, however electron beam resist technology has had limited progress and this is now one of the main limiting factors in improved EBL performance. The high performance SML/SU-8 resist is a novel polymer that has been specifically designed to answer the demands of the EBL community. It can be simultaneously patterned into high resolution and high aspect ratio patterns, even at low acceleration voltages, and without the aid of proximity effect correction.

Type of usage

Waveguides, Nano Microfludic, Security features for protecting products by Holographic image. Working with SU8 is design of micro parts directly in the synthetic material. The photo resist itself serve as a patterning results from UV or X-ray lithography by means of a direct lithography process, (Courtesy of Nanoscribe GmbH, Germany, A. Vasdekis, LO-EPFL, Switzerland).

Formulation

Gersteltec offers ready-to-use high performance SML/SU-8 resist

Resist for Inkjet applications

  • Ink formulation optimized for inkjet printing
  • Low temperature processing 95-120°C
  • Low viscosity 4-10mPa*s
  • Low thermal expansion
  • CTE 27 (ppm/K)

Application areas

The SU8 Photoepoxy Inkjet series products are ready to use

Thermally cured version of SU-8 based epoxy resist for inkjet. Multilayered printed epoxy for circuit board (PCB), antenna, 3D Integration. medical devices, flexible batteries.

Type of usage

Gersteltec offers Inkjet solutions to micro-dispensing requirements by offering a combination of tailor-made ink development with consulting service. Gersteltec products enabled fabrication of inkjet printed solar cells as conductive and release layers, paper RFID antennas, touch screens, light sensors, spacers and smart windows ( Courtesy  Marijana Mionic LNMME-EPFL, Gersteltec Switzerland).

Our Trademark

Nanomaterials have unique properties which enables their utilization in functionl coating snd printing. Gersteltec research is. focused on developing Ready-to-use resist formulations of nanomaterials in a variety of viscosities and utilization of. these materials as “ink” and “paint” for customers requirements to reduced material waste. Providing ink  polymers solution for drop-on-demand and micro-dispensing devices. Gersteltec developed an inkjettable low-stress dielectric with low residual stress.

 

Resist for Micro-Mold Stamp Fabrication of PDMS Castings

  • X-ray, E-Beam and P-Beam imageable
  • High resolution
  • High optical transparency
  • High mechanical properties
  • Low thermal expansion
  • Low temperature processing 95-120°C
  • High replication fidelity
  • Excellent pattern replication down to sub nm features

Application areas

The SU8 Photoepoxy series for Micro Mold are ready to use

SU-8 Master for PDMS   Microflludic applications, rapid fabrication of SU-8 patterned silicon wafers for the replication of PDMS microfluidic devices.  

Type of usage

Our product can be used for replicating PDMS structure by fabrication of a SU-8 master mold that will serve as a patterned template for PDMS casting based on standard UV photolithography. Printing of microfluidic, microlenses, Planer and Optical waveguide and nanopore membrane arrays (Courtesy of POTOMAC, Baltimore USA and Elveflow, Paris France).

Formulation

Gersteltec offers ready-to-use formulated products for stamp fabrication with low cost efficient alternative to Si, quarts stamps

Display

  • High aspect ratio with vertical sidewalls
  • High Optical transparancy
  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 80-120°C

Application areas

The SU8 Photoepoxy for display ready to use

Organic LCDs, Plastc OLCD, LCD, OLED, AMOLED, TFT, plastic substrate mouting onto glass carrier, OTFT pixel, colour filter array, black matrix with high OD. Electrphoretic, Electrowetting (Courtesy of EuroLCDs,  Latvia).

Type of usage

The goal of the display industry is to meet the same performance as glass, but on plastic, our resin has near ideal optical properties with low temperature processing and flexible behavior.

Our Trademark

Gersteltec offers its customers solutions to their Display requirements by providing a combination of consulting services, application development of high transparency products with high aspect ratio  resolutions an be transparent or black for pixels applications design.

 

 

Flexible electronics

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 80-120°C
  • High resolution

Application areas

The SU8 Photoepoxy for Flexible electronics ready to use

Organic thin-film transistor (OFET), plastic OLCD, AMOLED, OLED, e-paper, flexible TFT, RFID tag. Assembly, Packaging. Flexible sensors by RTR (Courtesy of Prof. Xiaojun Guo, Shanghai Jiao Tong University Chine). 

Type of usage

Gersteltec offers innovative solutions to flexible polymer requirements by offering a combination of tailor-made photoresist development with a consulting service, flexible sensors, batteries (Courtesy of M. Mionic, LNNME-EPFL, Gersteltec,  Switzerland)

Formulation

Gersteltec offers ready-to-use formulated products. Customers can select filler types according to their choice. Several common fillers are used to get the desired end products that offer extremely high mechanical, physical and thermal resistance.

3D Printing

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 80-120°C

Application areas

Type of usage

Gersteltec offers innovative solutions to 3D conductive and semi-conductive polymer requirements by offering a combination of tailor-made nanoparticles of silver embedded in the epoxy SU8.

The SU8 Photoepoxy for 3D printing ready to use

3D touch sensing, 3D heater, Electrostatic Micro gripper, Cantilivers and3D conductive structures ( Courtesy of H. Igbenehi, University of Surrey, Guilford. UK).

Our Trademark

Gersteltec offers its customers solutions to their 3D requirements by providing SU-8 with nanoparticales of silver or silica

 

 

Energy

  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 80-120°C

Application areas

The SU8 Photoepoxy for Energie ready to use

Development of specific interconnect that minimize energy lost by design 3D electrodes integrated into microfluidic channels. Such electrodes grant high control over the electric field and are more efficient in creating the required electric field strengths. ( Courtesy of  Kevin Keim , Guiducci Lab, EPFL, Switzerland)

Type of usage

Gersteltec offers innovative solutions to metal coated SU8 electrodes and interconnect design requirements by offering a combination of tailor-made photoresist development with a consulting service.

Formulation

Gersteltec offers ready-to-use formulated products. Customers can select filler types according to their choice. Several common fillers are used to get the desired end products that offer extremely high mechanical, physical and thermal resistance.

Micro-Lenses design

  • High transparancy to near UV and visible light
  • Low thermal expansion
  • CTE 27 (ppm/K)
  • Low temperature processing 80-120°C
  • Low viscosity 4-16mPa*s

Application areas

The SU8 Photoepoxy for Lenses electronics ready to use

Technology for producing VCSELs emitting in the full 1.2-1.6µm wavelength range, for applications in data communications and sensing. They are especially suitable for integration with silicon photonics and for eye-safe consumer applications (wavelength longer than standard VCSELs).

Type of usage

The lenses or such polymer coating of ready-made VCSEL wafers of any kind (not just wafer-fused long wavelength VCSELs) can yield higher output power and efficiency, and potentially broader modulation bandwidths. This is in addition to polymer protection of the upper semiconductor DBR (Courtesy of Prof. Eli Kapon LPN, EPFL Switzerland).

 

 

Our Trademark

Specifically designed for wafer-fused VCSEL technology.  Lenses deposition by Drop-on Demend Inkjet processes for VCSE’ls and Micro LED devices.

 

New Bussines

  • Good adhesion to metals
  • Low thermal expansion
  • CTE 17 (ppm/K)
  • Low temperature coating spray processing 95-120°C

Application areas

The SU8 Photoepoxy Inkjet series products are ready to use

Pipes,cars , Energy.

Type of usage

Gersteltec offers coating solutions by spray to offering a combination of tailor-made nano-composites Polymer /Epoxydevelopment with a consulting service.

Formulation

Gersteltec offers ready-to-use formulated products. Customers can select filler types according to their choice. Several common fillers are used to get the desired end products that offer extremely high mechanical, physical and thermal resistance.

Semiconductors Manufacturing Fields

  • Good adhesion to metals
  • Low thermal expansion
  • CTE 17 (ppm/K)
  • Low temperature coating spray processing 95-120°C

Application areas

The SU8 Photoepoxyfor Semiconductors applications

Semiconductor devices are used for a wide range of products including information, smartwatch, smartphones and tablets, PCs, automobiles and precision machinery.  

Type of usage

Gersteltec offers high pur photoresist for semiconductors as vias design, low stress dielectric, spacer design for laser technology. 

Formulation

Gersteltec offers ready-to-use high pur formulated products for semiconductors applications