Switzerland
Switzerland
info@gersteltec.ch +41 (0)79 564 34 23 General-Guisan 26, 1009 Pully, Switzerland CH
English (UK)
Switzerland
Switzerland
info@gersteltec.ch +41 (0)79 564 34 23 General-Guisan 26, 1009 Pully, Switzerland CH
English (UK)
Gersteltec Engineering Solutions
Swiss Made SU-8 photoepoxy functional products for MEMS and microelectronics

Our Classic products: SU-8

Today you need more from your suppliers than just materials. You need specific resources that can carry out your project from conception to commercialization. Gersteltec can be your partner in achieving this result.

Gersteltec offers several kinds of classic SU-8 photoresists products under different products forms that can give your company an extra competitive edge. GM10xx and GMPI10xx series for semiconductors applications.

Gersteltec

Gersteltec offers ready-to-use formulated products with different types of filler, pigments, ink and solvent (ceton, ether acetate, aromathic and more) according to your needs. Gersteltec photoepoxy materials and products meet and exceed the needs of the world´s leading microsystem device makers with advanced functional SU-8 photoresist.

GM10xx series

  • GM1010 for layers smaller than 0.2 µmSpray
  • GM1020 for layers between 0.2-0.5µmSpin, Spray, Inkjet
  • GM1030 for layers between 0.5-1.2µmSpin, Spray, Inkjet
  • GM1040 for layers between 0.9-3.2µmSpin, Spray, Inkjet
  • GM1050 for layers betwwen 3-8µmSpin, Inkjet
  • GM1060 for layers between 5-27µmSpin, Inkjet
  • GM1070 for layers between 15-200µmSpin, Inkjet
  • GM1075 for layers between 100-400µmSpin, Inkjet

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Thin Resist

GM1010

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors passivation/interlayer • Coating by Spray, Inkjet, E-Beam • Display and flexible display • Planarisation layers for AMOLED • MEMS, BioMEMS, NanoMEMS, (Courtesy of Prof. Xiaojun Guo, Shanghai Jiao Tong University Chine).
  • Properties• Thin layers: <0.2μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm (Courtesy of Prof. Eli Kapon LPN, EPFL Switzerland).

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Thin Resist

GM1020

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Display and flexible display • Planarisation layers for AMOLED • MEMS, BioMEMS, NanoMEMS, (Courtesy of Prof. Eli Kapon LPN, EPFL Switzerland).
  • Properties• Thin layers: 0.2-0.5μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm,(Courtesy of Prof. Eli Kapon LPN, EPFL Switzerland).

* To be able to see the datasheets of the diferent products, please create an account

Thin Resist

GM1030

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Interconnect by different metal coated SU8 electrodes, Coating by Spray, Inkjet, E-Beam • Microfludics • MEMS, BioMEMS, NanoMEMS
  • Properties• Thin layers: 0.5-1.2μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm, (courtesy of Sebastien Jiguet Gersteltec Switzerland).

* To be able to see the datasheets of the diferent products, please create an account

Thin Resist

GM1040

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Microfludics • MEMS, BioMEMS, NanoMEMS, (Courtesy of Marc Heuschkel , Qwane).
  • Properties• Thin layers: 0.9-3.2μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm (Courtesy of Kevin Keim, Guiducci Lab, EPFL, Switzerland).

* To be able to see the datasheets of the diferent products, please create an account

Thin Resist

GM1050

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Microfludics • MEMS, BioMEMS, NanoMEMS, (Courtesy of EuroLCDs,  Latvia).
  • Properties• Thin layers: 3-8μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm

* To be able to see the datasheets of the diferent products, please create an account

Thick Resist

GM1060

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Microfludics • MEMS, BioMEMS, NanoMEMS
  • Properties• Thick layers: 5-27μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm, (courtesy of Duchamp Margaux Marie and Sebatien Jiguet LMSI4 EPFL Switzerland).

* To be able to see the datasheets of the diferent products, please create an account

Thick Resist

GM1070

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Microfludics • MEMS, BioMEMS, NanoMEMS
  • Properties• Thick layers: 15-200μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm, (courtesy of Sebatien Jiguet LMSI4 EPFL Switzerland).

* To be able to see the datasheets of the diferent products, please create an account

Thick Resist

GM1075

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time • Low processing temperature
  • Applications•Thick layer for MEMS, Microfludic, LIGA
  • Properties•High resolution • Thick layers: 100-400μm •Vertical sidewalls •Aspect ratio up to 30 by standard UV lithography • Short bake time • Low processing temperature

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GMPI10xx series

  • GMPI1010 for layers smaller than 0.2 µmSpray
  • GMPI1020 for layers between 0.2-0.5µmSpin, Spray, Inkjet
  • GMPI1030 for layers between 0.5-1.2µmSpin, Spray, Inkjet
  • GMPI1040 for layers between 0.9-3.2µmSpin, Spray, Inkjet
  • GMPI1050 for layers betwwen 3-8µmSpin, Inkjet
  • GMPI1060 for layers between 5-27µmSpin, Inkjet
  • GMPI1070 for layers between 15-200µmSpin, Inkjet
  • GMPI1075 for layers between 100-400µmSpin, Inkjet

* To be able to see the datasheets of the diferent products, please create an account

Thin Resist

GMPi10xx

  • Performances• High resolution • Vertical sidewalls • Aspect ratio up to 30 by standard UV lithography • Short bake time
  • Applications• Dielectric layer with high resolution and complex shape for transistors • Coating by Spray, Inkjet, E-Beam • Display and flexible display • Planarisation layers for AMOLED • MEMS, BioMEMS, NanoMEMS
  • Properties• Thin layers: <0.2μm • Chemically resistant • Thermal stability: 350°C • Young’s modulus: 4.6 GPa • Hardness: 370 MPa • CTE: 52 ppm

* To be able to see the datasheets of the diferent products, please create an account

Innovation and investment in the future are hallmarks of Gersteltec's approach

SU-8 photoresist is based on an epoxy resin developed by IBM. SU-8 is a thick, near-UV photoresist technology through i-line, and has advantages for the semiconductor industry as well as for microtechnologies and nano applications.

SU-8 is used in the development of MEMS, MOMES, UV-LIGA microfabrication and coatings. SU-8 can be patterned by several lithography techniques, such as X-ray, UV and e-Beam.

SU-8 is specifically used for applications requiring high aspect ratios in very thick layers with vertical sidewall profiles.

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See our conditions of sales